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- Bruker Acquires Hecus MICROcaliX(R) Product Line to Expand Product Portfolio for Small Angle X-ray Scattering (SAXS)
- Bruker receives Honorable Mention for Seattle Business magazine’s 2011 Washington Manufacturing Award
- Bruker Announces $10M in New Orders for Novel Metrology Tools from Leading Semiconductor Manufacturer
- Bruker AXS in Karlsruhe has new phone numbers
- Application Report XRD 12 - D8 FABLINE
Upcoming Events
- Pittcon 2012
Mar 11-15, Orlando, Florida, USA - SEMICON China 2012
Mar 20-22, Shanghai, China - ARAB LAB 2012
Mar 26-29, Dubai, UAE - DPG Spring Meeting
Mar 27-29, Berlin, Germany - 2012 NUANCE-Bruker International Symposium
Apr 05, Evanston, IL, USA - ANALYTICA 2012
Apr 17-20, Munich, Germany
X-ray Metrology
- X-ray Metrology with the D8 FABLINE
The semiconductor industry is continuously challenged to produce smaller devices and purer compounds, all under a higher throughput. Bruker AXS offers world-leading technology for fast and precise measurements to monitor the process.
For any application, whether it is thin film analysis, checking the composition of solder bumps or monitoring contamination, Bruker AXS offers optimised solutions for fully automated FEOL, BEOL tools and state of the art lab R&D systems.
- Wafers from 6“ to 300 mm
- Horizontal sample mount for safe wafer handling and high sample throughput
- SECS/GEM interface for straightforward fab integration
- Automatic pattern recognition for precise micro analysis
- Integrated single or dual FOUP port interface for wafer loading
