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- Bruker Acquires Hecus MICROcaliX(R) Product Line to Expand Product Portfolio for Small Angle X-ray Scattering (SAXS)
- Bruker Announces $1.3 Million Contract with ThyssenKrupp Stainless USA
- Lab Report SC-XRD 46 - Higher Dimensional Crystallography
- Lab Report XRF 103 - S2 RANGER with XFlash LE and GEO-QUANT M
- Bruker Announces Advanced G4 ICARUS Combustion Gas Analyzer for Metal Foundry and Heat Treatment Applications
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Mar 11-15, Orlando, Florida, USA - SEMICON China 2012
Mar 20-22, Shanghai, China - ARAB LAB 2012
Mar 26-29, Dubai, UAE - DPG Spring Meeting
Mar 27-29, Berlin, Germany - 2012 NUANCE-Bruker International Symposium
Apr 05, Evanston, IL, USA - ANALYTICA 2012
Apr 17-20, Munich, Germany
Semiconductors
Intrinsic, SiGe and compound semiconductors are the all-important building blocks of the modern world of electronics and communication. Scientists and engineers design materials with new characteristics, develop new production processes and ensure the quality of the products. X-ray methods provide a non-destructive way to obtain a large set of physical parameters of the semiconductor materials. With a wavelength that matches the crystalline lattice spacings involved, X-rays are the natural probe for any type semiconductor sample. Absolute analysis results without calibration are possible, in contrast to traditional methods that use wavelengths of the order of a micrometer.
The hot topic for all semiconductor applications is the examination of the samples, even on large 300 mm wafers, with about 50 µm spatial resolution, either for R&D as well as under routine production control conditions. Bruker AXS offers tailor-made solutions to fit your experimental needs:



