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Product News
- Bruker AXS Announces Closing of S.I.S. Acquisition and Exhibits its New Atomic Force Microscopy (AFM) Product Line at EMC 2008
- Quantitative Screening for RoHS Regulated Elements by XRF
- Bruker AXS Announces Agreement to Acquire Atomic Force Microscopy (AFM) Company S.I.S. Surface Imaging Systems GmbH
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Semiconductors
Intrinsic, Si/Ge-, and compound semiconductors are the all-important building blocks of the modern world of electronics and communication. Scientists and engineers design materials with new characteristics, develop new production processes, upscale those processes and ensure the quality of the products. X-ray methods provide a non-destructive way to obtain a large set of physical parameters of the semiconductor materials. With a wavelength that matches the crystalline lattice spacings involved, x-rays are the natural probe for any type semiconductor sample. Absolute analysis results without calibration are possible, in contrast to traditional methods that use wavelengths of the order of a micrometer.
X-ray Analysis of semiconductors
A number of different x-ray methods exist for obtaining parameters such as layer thickness, layer orientation, lattice parameter, lattice mismatch, strain and relaxation, chemical composition, surface and interface roughness, porosity, defects, crystallite size, and substrate orientation. With the appropriate configurations, a D8 DISCOVER DIFFRACTION SOLUTION allows the methods of X-Ray Reflectometry (XRR), High-Resolution X-Ray Diffraction (HRXRD), micro diffraction (µXRD), Grazing Incidence Diffraction (GID), Grazing Incidence Small Angle X-Ray Scattering (GISAXS), and preferred orientation and texture.
X-ray tools for research, development, and production control
The hot topic for all applications is to examine the parameters of the semiconductor samples with about 10 µm spatial resolution, even on large 300 mm wafers, under development conditions as well as under routine production control conditions. This requires a dedicated instrumental setup with the appropriate combination of x-ray optics, sample stages and detector(s). The modularity of the D8 DISCOVER DIFFRACTION SOLUTION family means an easy adaptation to the experimental requirements: stress free wafer mounting, clean room conditions, automatic sample handling with FOUP ports and wafer robots is part of the range of products, as well as automatic measurement execution and data evaluation without user intervention, optional SECS/GEM interface and SEMI standards compliance.



