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• The AcuityXR™ Measurement Mode combines patent-pending, Bruker hardware and software technology to enable select ContourGT Non-Contact, 3D Optical Surface Profilers to break the optical diffraction limit and deliver lateral resolutions that previously were considered impossible to achieve in optical microscopy. This capability enables dramatically enhanced analyses in semiconductor, medical, and precision machining applications where feature sizes are shrinking as the need for quality is increasing.
• The NEW In-Motion Solution: MEMS package for Wyko NT9000 Series Optical Profilers enables detailed characterization of MEMS and other micro-devices during operation, including optical switches, micro-mirrors, and accelerometers. Slow-motion video provides a visual display of sample movement in three dimensions, providing fast static and dynamic surface metrology on a single system. In-Motion integrates a proprietary stroboscopic illuminator, drive electronics, data acquisition and data analysis software to capture real-time measurement data of a sample as it cycles through its range of motion, at operating frequencies from 11 hertz to 2.4 megahertz.
• The Annular Analysis Software package permits advanced analyses such as displacement, acceleration, r-theta, and radial slope for calculating parameters on rings, washers, clamps, etc.
• The MATLAB Interface Software package allows the integration of custom data analysis using the popular MATLAB data visualization environment. The package includes scripts to export OPD files into MATLAB, some simple examples of Matlab analyses, and scripts to re-import the data and results back to Vision, along with a full MATLAB license.
• The Optical Analysis Software package provides common analyses used in lens design and manufacturing verification, including such calculations as asphere fit and zernike polynomial coefficient determinations
• The Stitching Software package uses Bruker’s patented stitching capability to increase the field of view by seamlessly fusing adjacent data sets from the sample surface, and analyzing them as a single data set with annular and rectangular layouts. The software effectively enlarges the field of view while maintaining magnification and spatial resolution.
• The SureVision Software package provides threshold- and template-based analysis to enhance automation of measurements and allow analysis of a wide variety of samples without the need for many “specialized” analyses. The package permits separation of datasets into individual analysis ‘islands’, and can perform pattern recognition, surface texture and shape analysis for each individual island.
• The TCP/IP Control Interface Software package allows the simplified operation and control of the profiler from an outside application. It provides easy-to-use interface control for the tool (including stages and sample handling) and allows integration of customer-supplied hardware.
• The Thick Film Software package analyzes optically transparent films from 2µm up to 150µm thick by de-convolving the overlapping fringe envelopes, delivering both top and bottom surface shape, and film thickness point by point.
• The Advanced APS software package updates and enhances the standard automation program summary. The software boasts advanced filtering capabilities as well as run-time plotting and is specifically designed for improved quality control with such features as lower and upper control limits and post acquisition plotting.
• The Deflection Scan software package performs a static scan with a ramping of force over time to allow accurate determination of stiffness of cantilevers and similar small parts.
• The Stress Measurement software package utilizes Bruker’s proprietary algorithm to simultaneously calculate tensile and compressive stress on wafers and other substrates. This package enables the Dektak instrument to quickly and accurately perform film delamination studies and other internal thin film stress analyses on a variety of deposited films.
• The Vision software package includes over 200 analyses and visualization tools for post processing data visualization and analysis. This award-winning package visualizes data with 2D and 3D plots with full-screen viewing, rotation, and grid display and includes color palette for heights and background color modification.
• Analysis Packages
• The MicroForm software package reveals difficult shapes and overcomes steep slopes, improving accuracy to within 0.25°.
• The Stress Measurement software package calculates tensile and compressive stress on wafers and other materials.
• The Stitching software package allows multiple scans to be stitched together with Veeco’s proprietary algorithm for a long scan that accurately determines film stress and substrate shape.
• The 3D Mapping software package enables the ability to create large-area, highly accurate topological maps for detailed analysis with the industry-leading Vision software package.
• The Cantilever Deflection software package is a unique twist on the scan, where instead of scanning the sample under the stylus, the sample remains fixed and the force on the stylus is ramped. This algorithm is primarily used to determine the properties of cantilevers, such as Young’s Modulus and other bulk physical properties.
• Solar Metrology Upgrade package - Optimize your NT9100 Optical Profiling System for crystalline silicon photovoltaic (PV) cell production and process development metrology with a custom 156-millimeter programmable stage that allows for edge-to-edge measurements on 6-inch solar cells. This upgrade package also includes a porous vacuum chuck that securely and safely mounts standard PV cells.
• NPFLEX Swivel package - The Swivel Package allows for manual positioning of the optical metrology head on angle, effectively changing the optical axis within ±45 degrees from the normal perpendicular-to-stage plane. This capability is useful when access to sample sides and angled surfaces is a common, consistent requirement and when custom fixturing is not practical, for example the inspection of machined edges and side surfaces on extra large, heavy parts. Due to the additional manual motion available with this package, the standard objective turret is not offered with this option. The swivel package includes motorized coarse Z-motion for easy up and down movement while the head is locked in an angled position.