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Learn About Stylus and Optical Metrology Technologies, Techniques, Modes, & Applications
Incorporating the latest advances in Stylus and Optical Metrology (SOM) techniques, these free learning resources provide you with detailed information and practical uses for Bruker’s SOM technologies. Written by leading scientists and technicians, these application notes describe the analysis of a sample, step-by-step, and highlight the advantages of using Bruker’s instruments for this purpose.
Quantitatively Measuring Surface Texture and Shaft Lead of Dynamic Sealing Systems (AN549) | |
Traditional measurement techniques are unable to keep pace with today’s smoother automobile shafts and more rigorously controlled seal interfaces. Tighter specifications demand a more robust, gage-capable metrology solution that can quantitatively measure lead angles to the tolerances outlined in industry specifications, such as ISO 6194-1:2009 and RMA OS-1-1 rev. 2004, thereby improving production quality and yield. This application note details a metrology solution that addresses these issues and provides manufacturers a way to measure lead angle both quantitatively and repeatably with complete confidence in the results. |
 Surface textures using a 2D contact stylus technique. |
White light interferometry is firmly established as being among the fastest, most accurate, and most versatile surface measurement techniques available to researchers and manufacturers. Traditionally, interferometric technology does have a well-known limitation in lateral resolution compared to a couple of other techniques. This application note details Bruker’s development of an interferometric measurement mode, AcuityXR™, that effectively overcomes this optical diffraction limit, resolving greater detail in many surfaces without compromising the many other benefits of white light interferometry. |
Image taken with the AcuityXR PSI. |
Low-Noise Interferometry Enables Characterization of Steep and Rough Surfaces (AN544) | |
Optical profilers that employ white light interferometry are one of the most accurate and flexible metrology tools for precision three-dimensional surface characterization. They are instrumental in an incredibly diverse range of industrial applications, from the measurement of data storage read-write heads or the cylinder walls of engines to the characterization of the drying rates of paint and adhesives, semiconductor linewidths and spacing analysis, and medical devices metrology. |
Rough surface metrology of polishing pad. |
Precision Surface Metrology Enables Solar Efficiency Gains (AN543) | |
The rapid, accurate, and versatile metrology solutions offered by Bruker's stylus and optical profilers are being utilized by many solar cell manufacturers to increase yield and lower the overall production cost of solar cells through quantification, qualification, or monitoring of various processing steps. |
Characterization of a solar cell. |
Stylus-based surface profiling is a standard technique for accurate, repeatable surface shape, topography and step height measurement in applications ranging from semiconductor R&D to solar cell QC. This application note describes the advantages of 3D measurement options available through a combination of Bruker's Dektak® Stylus Profiler and Vision® 3D analysis software. |
Generated on the Dektak 150 using Vision 3D analysis. |
Greater Measurement Detail with High-Definition Vertical Scanning Interferometry (AN541) | |
As the high-tech industry continues to pursue ever-shrinking dimensions, increasingly stringent quality demands, and faster throughput, it has been necessary to continue to expand the limits of interferometric technology. Metrology instrumentation manufacturers have had to respond to this challenge with continued advances in profiler technology. Bruker’s new high-definition vertical scanning interferometry (DDVSI) mode utilizes an innovative algorithm to deliver sub-nanometer precision on a wide range of surfaces in a single measurement, significantly streamlining profiler operation for a range of applications. |
90nm tall cross-hatch bars can be measured precisely and easily. |
Optical Profiling Provides Comprehensive Metrology for Stent Coatings (AN539) | |
Balloon angioplasty and stent placement has drastically reduced the need for major surgery and its associated risks, making it the preferred means of treating heart ailments and other corporal vessel weaknesses. The ability to accurately quantify stent coating thickness and uniformity is a crucial requirement for effective drug-eluting stent development and manufacture. This application note discusses the advantages optical profiling provides for the characterization of single- and multi-layer stent coatings. |
A Vision 3D analysis reveals a pinhole in a stent's coating. |
Optical Profiling Provides 3D Measurement of Blades and Sharps (AN538) | |
Optical profiling is a well-established method for accurate, repeatable and rapid 3D measurement of surface shape and roughness. The non-contact technique has been applied to research and production measurement of precision blades and many other medical-grade instruments. This application note discusses how optical profiling is used to measure and control key quality parameters in the production of consumer- and surgical-grade blades and sharps. |
Roughness and shape of medical-grade syringe tip. |
Optical Profiling Enables High Volume Stent Manufacturing (AN537) | |
Stents have revolutionized treatment for atherosclerosis by reducing the possibility of narrowing of the artery after it is treated. These small stainless steel mesh tubes are designed for insertion into diseased arteries, typically of patients receiving angioplasty or an atherectomy. This application note discusses how optical profiling provides non-contact, 3D, measurement of stent shape, defects and coatings, to enable high-volume production measurement of these life-critical devices. |
CAD representation of an arterial stent. |
Over the years, increasingly effective means have been developed for measuring surface topography and for using this data to understand wear. 3D measurement techniques have led to the development of parameters which allow engineers to correlate wear to particular manufacturing processes and/or wear mechanisms. By further developing these techniques engineers hop to be able to predict, and thereby extend, component life. |
Wear mechanisms affecting sensor performance. |
Characterizing MEMS Devices Through Transparent Media (AN528) | |
Optical profiling (white light interferometry) has long served as a standard technique for measuring surface topography of MicroElectroMechanical Systems (MEMS) and optical MEMS devices. To date, most measurements have been made early in the manufacturing process, before the MEMS is packaged. Most devices, however, perform differently once encased in their final packages, which often include a nitrogen atmosphere, vacuum, or other special environments. A new method has been developed for testing MEMS devices through their transparent packaging, for rapid, accurate verification of actual device performance. |
The 20x Michelson objective |
Dektak Stylus Capabilities: How to Choose the Correct Stylus for Any Application (AN526) | |
Dektak® stylus profilers provide accurate, high resolution measurement of surface shape and texture. The heart of a Dektak system is its measurement stylus, which runs over the surface as the sample is moved beneath it on the stage. A variety of stylus shapes and sizes are available to optimize measurement for particular applications. This paper describes the variety of styli that are currently available from Bruker, and guidelines for choosing the optimal tips for your application. |
Roughness measurement with 12.5µm stylus. |
Surface Texture Analysis Using Dektak Stylus Profilers (AN525) | |
“Surface texture” refers to the local deviations of a surface from its “ideal” shape. Accurate characterization of surface texture is critical for controlling the function and reliability of precision components and the processes used to manufacture them. This application note discusses the basic characteristics of surface texture and illustrates how stylus profiling can be used to measure, analyze and control surface texture. |
Some parameters provided by Dektak stylus profiler. |
Optical Profiling Techniques for Characterizing Free-Form Optics (AN519) | |
Free-form optics pose unique challenges for process-control metrology, including larger slopes, steps, and overall heights. What’s more, optical designs using free-form optics often use fewer elements, leaving fewer ways to compensate for surface figure error. This reduction demands tighter tolerances from the optical elements, which in turn require higher accuracy and repeatability from measurement equipment. Thirdly, new data analyses are required to characterize the quality of such optics, as many traditional metrics such as Zernike coefficients are not applicable. Optical profiling (white light interferometry) offers a combination of resolution, speed and vertical range, which enables process-control measurement of the non-spherical surfaces which define free-form optics. |
Measured using phase shifting and coherence sensing. |
Thin Film Stress Measurement Using Dektak Stylus Profilers (AN516) | |
Bruker’s Stress Measurement Analysis, an optional software package for Dektak® stylus profilers, calculates tensile and compressive stresses and displays the results. This application note discusses stress measurement methodology, the algorithms behind the Dektak Stress Measurement Analysis, and important considerations for achieving accurate stress calculations. |
Results given by Stress Measurement Analysis software. |
MEMS in Motion: A New Method for Dynamic MEMS Metrology (AN514) | |
A new metrology method, developed by CalTech and exclusively licensed to Bruker, combines optical profilometry with stroboscopic illumination for dynamic measurement of MicroElectroMechanical System (MEMS) devices in motion. Stroboscopic illumination effectively “freezes” the motion of MEMS structures, allowing nanometer-resolution measurement of their surface shape. By varying the amplitude, phase and frequency of the drive signal, multiple measurements can be taken to describe the device’s full range of actuation/deformation. Moving MEMS structures can then be analyzed for flatness variation, tilt, lateral translation, linearity of motion, stiction, and other key device parameters. |
Template analysis for an in-plane resonator. |
Accurate Thick Film Measurement with Optical Profiling (AN512) | |
Thick films (˜3µm and larger) are used widely in the design and manufacture of MEMS devices, semiconductors and hybrid circuits. Accurate control over film thickness and uniformity is essential for maintaining device performance and achieving high-yield deposition processes. Optical profiling, or white light interferometry, has long been a standard technique for non-contact, 3D measurement of surface topography. The method also extends to thickness measurement of opaque and semi-transparent films. It is the only method that provides film thickness, uniformity and roughness, all in a single measurement of a few seconds in duration. |
Characterization of the top surface of a film. |
Characterizing Surface Quality: Why Average Roughness is Not Enough (AN511) | |
Three dimensional surface topography measurement techniques and parameters are well understood and widely adopted for characterizing surface finish and performance. Nevertheless, in many applications 3D parameters, chiefly average roughness (Ra), are the only parameters specified for controlling surface quality. In this article we will explore why 3D parameters continue to be used and, more importantly, how 3D parameters can be employed to provide greater insight into surface finish and performance. We will examine two cases in which 3D parameters have helped in the design and development of high-performance surfaces. |
Chemical and surface analysis of coil steel stock. |
Measuring Micro-Lens Radius of Curvature with a White Light Optical Profiler (AN509) | |
Microlenses are discrete or array-based spheres, aspheres and other optics used in a variety of applications, chiefly for focusing light into fibers for optical networking. Microlenses are typically 50µm – 5mm in diameter, with a radius of curvature (ROC) of 0.25 – 2.5mm. Controlling ROC is critical for properly focusing the beam on the fiber, and uniform ROC is necessary to minimize signal loss. Measuring ROC at production volumes is a challenging task; optical profiling provides the combination of speed, resolution and repeatability to serve this role. |
An array of microlenses approx. 20µm in height. |
Surface Measurement Parameters for Wyko Optical Profilers (AN505) | |
R Parameters that were originally developed for two-dimensional, stylus type profiling applications. Many of the statistics were later adapted for three-dimensional use as well, for systems such as optical profilers which are capable of true 3D measurement. The S Parameters provide roughness, spatial and hybrid information for 3D surfaces. The parameters provide 3D equivalents to the standard 2D R Parameters (Sa for Ra, Ssk for Rsk, etc.), as well as additional information relevant to 3D surfaces only. |
Wyko Optical Profiler |
Large Field of View, High Spatial Resolution Surface Measurements (AN504) | |
High spatial resolution over a large field-of-view (FOV) can be obtained by stitching together multiple high spatial resolution measurements of adjacent areas of a measured surface. The measurements can be fit together in a global sense, or by matching the piston and tilt over the overlap region. Care must be taken in the stitching process to make sure the measurements are precisely overlapped to minimize errors. The larger the overlap the easier it is to match data sets, but of course more data sets are required to get a given field of view. This paper shows that a 20 percent overlap gives a good trade-off between having good repeatability and obtaining a large field of view with a minimum number of data sets. Typical measurement results are shown for stitching as many as 285 sub-regions. |
Wyko® Insight 2000 measuring the inside of an engine bore. |
White light interferometry (optical profiling) is a well-established technique for non-contact, 3D surface roughness and topography measurements. The method’s unique combination of resolution, speed and repeatability has proven ideal for R&D, process development and quality control in industries ranging from aerospace to semiconductors. Throughout the automotive industry, optical profiling is being adapted as a repeatable metrology method for metals, polymers, sensors and more. |
3D Optical profiler image of a steel shaft. |
Faster product development and reduced time-to-market have made optical surface profilers essential tools for three dimensional metrology of MEMS. Bruker’s Wyko NT Series Optical Profilers, available in a range of automation options, from the bench-top model NT1100 to the highly automated MEMS3500, utilize three distinct techniques for 3-D imaging and measuring of MEMS: Phase-Shifting Interferometry (PSI), Vertical Scanning Interferometry (VSI), and Enhanced VSI (EVSI). PSI measures height variations of several micrometers with angstrom-level resolution, on continuous surfaces that have no abrupt (pixel-to-pixel) height changes greater than ¼ the wavelength of light, which is typically 160 nm. White light interferometry, or VSI, was invented at Bruker, and measures nanometer-level surface roughness as well as larger height variations, including step heights up to several millimeters. EVSI brings the best of PSI and VSI together: angstrom level height resolution and millimeters of height range. |
Optical profiler image of micro-fluidic channels. |
In its most common application interferometry is a versatile measurement technology for examining surface topography with very high precision. At the heart of interferometry is the interferogram, which is the recorded interference signal of two beams of light exiting from the same source. An interferogram carries a wealth of information about the profile of an object under test and its material characteristics. This article serves as a short introduction to interferometry, its major measurement techniques and its primary applications in industry today. |
Section of a comb capacitor drive using EVSI. |
