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- Bruker Expands its Small Angle X-ray Scattering (SAXS) Product Portfolio
- Bruker Acquires Hecus MICROcaliX(R) Product Line to Expand Product Portfolio for Small Angle X-ray Scattering (SAXS)
- Bruker receives Honorable Mention for Seattle Business magazine’s 2011 Washington Manufacturing Award
- Bruker Announces $10M in New Orders for Novel Metrology Tools from Leading Semiconductor Manufacturer
- Bruker AXS in Karlsruhe has new phone numbers
Upcoming Events
- OrthoTec 2012
Jun 06-07, Winona Lake, IN, USA - ACHEMA 2012
Jun 18-22, Frankfurt/M., Germany - Seeing at the Nanoscale 2012
Jul 09-11, Bristol, UK - ACA Annual Meeting
Jul 28-Aug 01, Boston, Massachusettes, USA - ACS Fall
Aug 19-21, Philadelphia, Pennsylvania, USA
D8 FABLINE RMF
- Thickness and composition of solder bumps can be analyzed with µ-XRF
The system includes the vertical D8 goniometer with a UMC 300 stage for a horizontal sample position. It is fully SEMI S2 and S8 compliant and has a SECS/GEM interface for fab integration. It has a stress-free vacuum wafer chuck and it comes with an EFEM including a fan filter unit (FFU), handling robot, pre-aligner and one load port. The modularity of the tool allows optimisation according to the client’s needs.
The D8 FABLINE RMF offers you the best for thin film analysis with the combined strength of X-ray reflectivity (XRR) and micro X-ray fluorescence (µ-XRF). With a spot size down to 50 µm by 50 µm and automated pattern recognition, this tool is especially dedicated to the analysis and monitoring of product wafers, especially the Cu process, barrier and seed layers and metal interconnects.
