X-ray Metrology

D8 FABLINE R

49 points XXR map on HfO2 thin film on a 300 mm silicon wafer
49 points XXR map on HfO2 thin film on a 300 mm silicon wafer

The system includes the vertical D8 goniometer with a UMC 300 stage for a horizontal sample position. It is fully SEMI S2 and S8 compliant and has a SECS/GEM interface for fab integration. It has a stress-free vacuum wafer chuck and it comes with an EFEM including a fan filter unit (FFU), handling robot, pre-aligner and one load port. The modularity of the tool allows optimization according to your needs.

The D8 FABLINE R is the top-class solution if you are looking for fast and precise X-ray reflectivity (XRR) analysis on blanket wafers. It is dedicated to the analysis of layer thickness, layer density and surface or interface roughness of ultra-thin gate oxides, high-k and low-k thin films, silicide and polycide films and barrier and metal layers.