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CETR-CP-4 Chemical Mechanical Polisher

The World's Most Versatile & Advanced Bench Top CMP System

Bruker's CETR-CP-4 is the world's most versatile and advanced bench top chemical mechanical polisher (CMP) designed to meet your R&D needs. The unique, fully-computerized, acclaimed configuration allows polishing of up to 4-inch diameter wafers and disks. The CETR-CP-4 measures in situ friction, coefficient of friction, temperature, downforce, wear, acoustic emission, etc., and can simulate all parameters such as velocity, load, and slurry flow rate to mimic a big CMP system.

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Study & Develop All Aspects Of Chemical Mechanical Polishing

• Test and develop various slurries with different particles, materials, concentration, oxidizers, inhibitors, etc.
• Test and develop pads with different materials, groove shape, dimensions, elasticity, life, etc.
• Test and develop pad conditioners to optimize pad cut rate, conditioning, efficiency, etc.
• Develop retaining ring materials for CMP to optimize friction, wear, life, etc.
• Test removal rates, defectivity repeatability, process optimization, etc.

Study Or Develop Various Materials In A Variety of Applications

• Semiconductor - copper, Ta, TaN, Al, Si, SiO, Ru, WC, solar cells, PVD, CVD, films, etc.
• Compound Semiconductor - GaAs, Indium, Phosphide, Mercury, Cadmium
• Biological Applications - tooth, bone, Ti, steel, etc.
• Opto Electronics - LED, sapphire, infrared windows polishing laser materials, microlenses, micro-optics, lithium niobate, lithium tantalate, potassium titanyl phosphate, etc.
• More Applications & Materials - please contact us for your specific application and material needs

Simultaneous Realtime Monitoring & Processing

• Normal loads and friction forces via proprietary sensors, at both wafer pad and conditioner pad interfaces
• Contact acoustic noise (elastic waves) via proprietary sensors and amplifiers in both wafer pad and conditioner pad interfaces
• Use acoustic waves to characterize defectivity, scratches, and delamination during processing
• Measurements of the temperature of the incoming slurry, pad surface, and outgoing process waste